EPO-TEK® H62 - Thermally Conductive Epoxy

Pentra-Sil® (HL) is a high-solids blended hybrid lithium densifier designed for concrete densifying and hardening in newly placed or existing slabs. Its reactive formulation fills the micro-pores of the concrete, strengthening the surface and prolonging its life. Pentra-Sil®...

PILE ANCHOR GROUT is a two-component, 100% solids, high strength, pourable epoxy anchoring grout. 

A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.

ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

ULTRABOND® EPX-3CC is everything you need, and nothing you don’t, because it’s the perfect balance between high performance and high volume. With an installation temperature range of 48 °F to 108 °F, and a full cure in 4...