EPO-TEK® H70E-2 - Thermally Conductive, Electrically Insulating Epoxy

Water resistant, room temperature cure adhesive that meets FDA regulations Sections 175.105 and 175.300 permitting use in "indirect" food contact applications.

ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...

Room temperature-curing, thermally and electrically insulating epoxy.

A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.

Quick set, thixotropic polyurethane encapsulant with flow control available in TriggerBond®.