EPO-TEK® H70E-2 - Thermally Conductive, Electrically Insulating Epoxy

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

DP Wrap is a polyethylene film with a high-tack adhesive designed to provide protection from moisture, dust, debris, and paint. The film is easily removed, tear resistant and UV resistant.Covering round and rectangular duct during transportation, storage and...

EPX50-OVERLAY FAST is a fast-setting, moisture-insensitive, low-modulus, two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as a binder...

ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.

High thermal conductive silver filled adhesive.