EPO-TEK® H70E-2 - Thermally Conductive, Electrically Insulating Epoxy

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

A multi-purpose, pressure sensitive, clear, industrial strength aerosol spray adhesive with quick tack and high shear strength. DP 77 is provided in convenient and easy to use aerosol cans. DP 77 is used to adhere fiberglass duct liner...

Highly thixotropic epoxy with non-flowing properties and high temperature resistance. 

ASI 335 Neutral Cure RTV Silicone is a one-part, non-slump, moisture cure sealant/adhesive that cures to form a tough rubber with long-term flexibility and durability.Due to the formulation, ASI 335 offers advanced adhesion to a variety of surfaces...

Pentra-Clean™ (CR) cleans floors by cutting through dirt, grime and residue while using reactive Nano-Lithium® to harden, protect and restore gloss and durability. Cleaning with Pentra-Clean™ (CR) increases the floor’s longevity, reducing maintenance and costly repairs. Ideal for...

Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.