EPO-TEK® H72 - Thermally Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

ISO 10993 Medical grade low viscosity clear epoxy with high spectral transmission. 

EP15-GROUT XP is a low exotherm formulation of our EP15-GROUT product, providing an extended pot life that makes it more user friendly for warm weather applications and deep pour projects that require more working time. This high-performance epoxy...

With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...

Room temperature-curing, thermally and electrically insulating epoxy.