EPO-TEK® H72 - Thermally Conductive Epoxy

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...

Transil® SXT is a clear, penetrating, breathable, surface-applied liquid treatment which strengthens, protects and hardens concrete pavements extending the service life up to 35%. The high performance treatment maximizes durability and longevity of tined, diamond ground, grooved, milled, shot-blasted, and/or re-textured surfaces...

ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...

A water based protective coating formulated with an EPA Registered preservative that prevents the growth of mold, mildew, and fungus on the surface of the coating. It is recommended as an encapsulant on worn or damaged fiberglass to...

EPC-OVERLAY is an all-in-one, 100% solids, solvent-free, moisture-insensitive, high-performance, multi-purpose epoxy polymer concrete overlay system. This next generation system is easy-to-use and cost-effective, combining a low-modulus epoxy resin system with a high-quality engineered blend of graded aggregate to...