EPO-TEK® H72 - Thermally Conductive Epoxy

High Temperature  Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.

CRACKBOND® INDUSTRIAL CITRUS CLEANER is bio-renewable, organic, and safe-to-use solvent ideal for removing uncured epoxies from tools and equipment. It also performs exceptionally well as a heavy-duty stripper and degreaser, and can be used for general cleaning of...

Premium quality, solvent based, fast drying, non-flammable liquid adhesive, pressure sensitive fiberglass duct liner insulation adhesives. They are supplied in convenient spray canister systems which are both portable and cost effective. DP 2590 CA is available as a...

Seal&Shine Finish is the final step in the SlabArmor™ system, intended to be applied after the placement and finishing process. This high-performance, high-gloss finish, seals, protects and extends the life of your SlabArmor™ floor, eliminating the need for...

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...