EPO-TEK® H74 - Thermally Conductive Epoxy

10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates.  Its flexibility allows bonding to substrates with high coefficients of thermal expansion.

A UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1015 allows for better coverage and ease of application. It exceeds...

Room temperature-curing, thermally and electrically insulating epoxy.

General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics. 

Long pot life, high temperature epoxy designed for semiconductor, hybrid, fiber, and optical applications.  Fiber optic adhesive designed to meet Telecordia 1221.