EPO-TEK® H74 - Thermally Conductive Epoxy

SlabArmor™ Starter is the original colloidal silica curing/finishing aid for concrete developed in 2009, whose popularity has skyrocketed more recently with the growing use of “thirsty” low-carbon concrete using Type- 1L cement. In addition to being an excellent...

Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.

Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.

CRACKBOND® V120 LO-MOD is a two-component, moisture insensitive, low modulus, high strength epoxy healer/sealer penetrant, designed to seal micro cracks in bridge and parking structure decks and as an overlay for high friction surface treatment. The super-low viscosity...

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.