EPO-TEK® H74

EPO-TEK® H74 Thermally Conductive Epoxy

This thermally conductive epoxy is designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general.

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File Size

Technical Data Sheet

Document Name EPO-TEK® H74

File Size 555.6 KB

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Safety Data Sheet

Document Name EPO-TEK® H74

File Size 607.8 KB

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Certifications

Brand:

Epoxy Technology

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