EPO-TEK® H81A - Electrically Conductive Epoxy

Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

COLORFAST™ Stain is a chemically reactive, Nano-Lithium® enhanced product that creates beautiful, durable colored concrete. High-solids treatment utilizes lithium densifier to harden and protect both interior and exterior slabs. COLORFAST™ Stain is an ideal solution for all construction...

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

EP15-GROUT XP is a low exotherm formulation of our EP15-GROUT product, providing an extended pot life that makes it more user friendly for warm weather applications and deep pour projects that require more working time. This high-performance epoxy...