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DP 2590 / DP 2590 CA
SOLVENT BASED SPRAY ADHESIVE
Premium quality, solvent based, fast drying, non-flammable liquid adhesive, pressure sensitive fiberglass duct liner insulation adhesives. They are supplied in convenient spray canister systems which are both portable and cost effective. DP 2590 CA is available as a...

70-3812NC
Aluminum Filled Epoxy
Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.

EP50-OVERLAY
Low Modulus Polymer Resin Overlay
EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.

EPO-TEK® HYB-353ND-TX2
UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
DP 2590 / DP 2590 CA
SOLVENT BASED SPRAY ADHESIVE
Premium quality, solvent based, fast drying, non-flammable liquid adhesive, pressure sensitive fiberglass duct liner insulation adhesives. They are supplied in convenient spray canister systems which are both portable and cost effective. DP 2590 CA is available as a...
70-3812NC
Aluminum Filled Epoxy
Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.
SEALANT CHIP BRUSHES
Sealant Chip Brushes
Available in 2" and 3" sizes
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
EP50-OVERLAY
Low Modulus Polymer Resin Overlay
EP50-OVERLAY is a solvent-free, moisture-insensitive, 100% solids, low-modulus, two-component polymer designed primarily for bonding skid-resistant overlays.


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Electrically Conductive EpoxyLet's talk
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