EPO-TEK® HYB-297-RT-HV - UV & UV Hybrid

EP-PATCH 7040 is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. This low-modulus material offers excellent bond strength and outstanding workability, providing extended working times for higher temperature applications. The EP-PATCH 7040 system combines a high-quality epoxy resin and curing agent...

EP-PATCH is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. It is characterized by high early strength, low modulus, excellent workability and excellent bond strength. The system combines a high-quality epoxy resin and curing agent with an engineered blend of graded...

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

All purpose thixotropic and room temperature-curing epoxy adhesive.

Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.