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EPX50-OVERLAY FAST
Rapid Set Epoxy Urethane
EPX50-OVERLAY FAST is a fast-setting, moisture-insensitive, low-modulus, two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as a binder...

EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

CONVERGENT Pentra-Sil® (AC)
pH Neutralizing Densifier and Hardener
Pentra-Sil® (AC) is an advanced alkalinity control treatment that reacts with concrete to neutralize its pH levels. Through this permanent reaction, slab sweating and efflorescence is significantly reduced. The lithium silicate in this product also densifies and hardens...

EPO-TEK® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

DP 5050
Water Based Weather Barrier Coating
A medium viscosity, premium quality, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5050 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...
EPX50-OVERLAY FAST
Rapid Set Epoxy Urethane
EPX50-OVERLAY FAST is a fast-setting, moisture-insensitive, low-modulus, two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as a binder...
EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
CONVERGENT Pentra-Sil® (AC)
pH Neutralizing Densifier and Hardener
Pentra-Sil® (AC) is an advanced alkalinity control treatment that reacts with concrete to neutralize its pH levels. Through this permanent reaction, slab sweating and efflorescence is significantly reduced. The lithium silicate in this product also densifies and hardens...
EPO-TEK® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...


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