EPO-TEK® HYB-297-RT - UV & UV Hybrid

EP-PATCH is a three-component, high-performance, 100% solids, multi-purpose, non-shrink epoxy patching mortar. It is characterized by high early strength, low modulus, excellent workability and excellent bond strength. The system combines a high-quality epoxy resin and curing agent with an engineered blend of graded...

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

Pentra-Sil® (C&N) cleans and neutralizes concrete floors that suffer from surface sweating and efflorescence. This first step of a two-part treatment stabilizes the alkalinity in concrete surfaces by infusing lithium ions throughout the substrate.

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

ASI 306 Electronic Grade Self-Leveling Silicone is a one component, RTV (room temperature vulcanizing) product that can be used for encapsulating, coating and sealing.No acetic acid or other corrosive by-products are generated during its cure which allows the...

ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...