EPO-TEK® HYB-353ND - UV Hybrid

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. 

Highly thixotropic epoxy with non-flowing properties and high temperature resistance. 

Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...