EPO-TEK® MED-354-T2 - Biocompatible Nonconductive Adhesive

ASI 55 Industrial & Construction Hybrid Sealant/Adhesive uses ASI’s innovative hybrid technology to provide a one part, elastomeric sealant/adhesive that will perform in a variety of demanding environments and applications without degrading.Unlike conventional polyurethanes and solvent based sealants/...

EP50-SC (Standard Cure) is a moisture-insensitive, 100% solids epoxy polymer engineered for skid-resistant overlay systems and other demanding infrastructure applications. Designed to provide exceptional bond strength, high early strength, and long-term durability, EP50-SC delivers reliable performance on bridge...

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

A premium grade, UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1010 allows for better coverage and ease of application....

ULTRABOND® 1300-FG is a two-component, fast-setting adhesive system that offers exceptional strength in anchoring and doweling applications. It is perfect for bonding applications that require a quick turn-around. It may be used in temperatures between 40 °F -...

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.