EPO-TEK® MED-354-T2 - Biocompatible Nonconductive Adhesive

Low outgassing silver Epoxy meeting MIL-STD 883 /5011 and NASA ASTM E585.

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

A mid-strength epoxy grout used primarily with wind applications. Early strength profile allows faster project times and early tensioning and stacking. This grout can reach 17,000 PSI compressive strength within 48 hours of placement. The savings will help...

A single component, high temperature hybrid epoxy for semiconductor and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a lower viscosity version of...

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

100% solids, semi-rigid, epoxy joint filler.