EPO-TEK® MED-354-T2 - Biocompatible Nonconductive Adhesive

ISO 10993 Medical grade thermally conductive epoxy, electrically insulating, low temperature curing epoxy. Ideal for temperature sensitive devices.  

Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

CRACKBOND® INDUSTRIAL CITRUS CLEANER is bio-renewable, organic, and safe-to-use solvent ideal for removing uncured epoxies from tools and equipment. It also performs exceptionally well as a heavy-duty stripper and degreaser, and can be used for general cleaning of...

CRACKBOND® V65 HI-MOD (formerly known as CRACKBOND® HEALER/SEALER) is a two-component, deep penetrating, fast cure, high strength epoxy coating that will reduce intrusion of moisture and water soluble materials into concrete. The ultra-low viscosity (65 cP) allows superior...

Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant.