EPO-TEK® MED-H20S - Electrically Conductive Adhesive

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

Pentra-Sil® (H) provides maximum hardening for concrete slabs and tilt-up construction. This lithium-based, pre-cure hardener reduces dusting and makes the surface more water, stain and abrasion resistant while increasing surface sheen over time. Pentra-Sil® (H) is applied in...

A Low VOC, solvent based, premium quality, UL Classified, high pressure/high velocity duct sealant for commercial and industrial supply and return air duct use. DP 1090 can be easily caulked or brushed when temperatures reach 0º F, allowing...

A premium quality, solvent based, high performance, fast drying, polystyrene insulation adhesive. DP 2585 is water resistant and temperature resistant to 180° F. It is ideal for bonding polystyrene, polyisocyanurate and phenolic foam insulation sheets and block without...