EPO-TEK® OE138 - High Temperature Thixotropic Epoxy

Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

All purpose thixotropic and room temperature-curing epoxy adhesive.

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

Pentra-Sil® (IH) was designed to give concrete polishers an easy-to-use densifier that greatly improves the final finish of polished concrete by dramatically hardening the substrate and allowing abrasive tooling to work more efficiently and effectively. The Pentra-Sil® (IH)...