EPO-TEK® OE145-5 - Nonconductive Adhesive

ASI 335 Window & Door Sealant is a single component, nonslump, moisture curing neutral cure oxime silicone that cures to form a tough, non-corrosive, flexible rubber with outstanding resistance to weather & UV degradation.ASI 335 Window & Door...

Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.

ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.

Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.

Pentra-Sil® (H) provides maximum hardening for concrete slabs and tilt-up construction. This lithium-based, pre-cure hardener reduces dusting and makes the surface more water, stain and abrasion resistant while increasing surface sheen over time. Pentra-Sil® (H) is applied in...

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...