EPO-TEK® OG116 - Epoxy-Based Thermal Post Cure

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

All purpose thixotropic and room temperature-curing epoxy adhesive.

A premium grade, water based, UL Classified duct liner adhesive specifically formulated for spray, brush, roller and coil line applications. It can be used to seal cut edges of fiberglass duct liner. DP 2501 can also be used...

Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

A medium viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 can be used for bonding and coating jackets of canvas, glass cloth and...