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EPO-TEK® OG116-31
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Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.

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Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.

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Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant.

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ULTRABOND® HYB-2CC
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EPO-TEK® OG116-31
UV Epoxy Encapsulant
Single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, and scientific/OEM industries.
EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
CRACKBOND® EPOXY REPAIR PASTE
Epoxy Repair Paste
Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant.
DP 5060
Low Viscosity Weather Barrier Coating
A premium quality, low viscosity, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5060 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...
EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
ULTRABOND® HYB-2CC
High Strength Concrete Anchoring Adhesive
For cracked and uncracked concrete, ULTRABOND® HYB-2CC is IBC approved for application in temperatures down to 23 °F. And for jobs where a quick cure rate is required, it will cure completely in 30 minutes at 70 °F. Approved...


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