EPO-TEK® OG142-112 - UV Cure Optical Epoxy

Versatile variable mix ratio epoxy with high peel strength and outstanding thermal shock, impact, and vibration resistance. Available in regular, non sag, and high viscosities.

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk. 

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...

A multi-purpose, pressure sensitive, clear, industrial strength aerosol spray adhesive with quick tack and high shear strength. DP 77 is provided in convenient and easy to use aerosol cans. DP 77 is used to adhere fiberglass duct liner...