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EPO-TEK® 730
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All purpose thixotropic and room temperature-curing epoxy adhesive.

EPX50-SC
Low-Modulus, Epoxy Urethane Co-Polymer
EPX50‑SC (Standard Cure) is a moisture‑insensitive, low‑modulus epoxy urethane co‑polymer engineered to deliver dependable performance in demanding concrete preservation environments. Applied as a 1/4" to 3/8" single‑ or dual‑layer system, it forms a durable, chemical‑resistant, and waterproof protective...

CONVERGENT STRiON:FORTIFY
Spray On Concrete Densifier
STRiON:Fortify is a revolutionary new method of concrete densification and hardening. Using groundbreaking new silica-free technology, STRiON relies on an ionic transfer process to disperse deep into concrete to make it more resilient, resistant to traffic, dustproof, easy...

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High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.

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Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.

Emulsion Adhesives
Evans Adhesive's emulsion adhesives deliver versatile, high-performance bonding solutions, offering strong, reliable adhesion and flexibility for a wide range of industrial and packaging needs.
EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.
EPX50-SC
Low-Modulus, Epoxy Urethane Co-Polymer
EPX50‑SC (Standard Cure) is a moisture‑insensitive, low‑modulus epoxy urethane co‑polymer engineered to deliver dependable performance in demanding concrete preservation environments. Applied as a 1/4" to 3/8" single‑ or dual‑layer system, it forms a durable, chemical‑resistant, and waterproof protective...
CONVERGENT STRiON:FORTIFY
Spray On Concrete Densifier
STRiON:Fortify is a revolutionary new method of concrete densification and hardening. Using groundbreaking new silica-free technology, STRiON relies on an ionic transfer process to disperse deep into concrete to make it more resilient, resistant to traffic, dustproof, easy...
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
70-3812NC
Aluminum Filled Epoxy
Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.
Emulsion Adhesives
Evans Adhesive's emulsion adhesives deliver versatile, high-performance bonding solutions, offering strong, reliable adhesion and flexibility for a wide range of industrial and packaging needs.


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