EPO-TEK® OJ2116 - Nonconductive Adhesive

All purpose thixotropic and room temperature-curing epoxy adhesive.

PILE ANCHOR GROUT is a two-component, 100% solids, high strength, pourable epoxy anchoring grout. 

EP100-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

EPX50-OVERLAY FAST is a fast-setting, moisture-insensitive, low-modulus, two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as a binder...

CRACKBOND® EPOTHANE T3 is a low-modulus, epoxy urethane skid-resistant overlay. It may be successfully applied and cured at temperatures between 60 °F and 95 °F (16 °C and 35 °C).