EPO-TEK® P1011S-2 - Silver Die Attach Polyimide

Polymer modified Portland cement blend of specialty aggregates and admixtures. Provides rapid setting, high strength, durable, concrete repairs. 

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. 

For anchoring threaded rod and rebar, railings, sign posts and parking meters, or patching holes and cracks in roads and sidewalks, ULTRABOND® HARD-ROK contains no metals to cause rust or stains and is suitable for interior or exterior...

ASI 0240 is a multi-use, sprayable liquid that can used when tooling sealants/caulk to more rapidly create a professional, clean looking seal. ASI 0240 also serves as a remover for all types of caulks, sealants, labels, capes and...