EPO-TEK P1011ST-2 Silver Polyimide Die Attach

EPO-TEK® P1011ST-2 Silver Die Attach Polyimide

Single component, modified polyimide, high temperature grade, silver-filled electrically conductive and thermally conductive adhesive designed for semiconductor die-attached and hybrid microelectronic packaging. It is a lower viscosity version of P1011-T2.

SDS TDS

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Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® P1011ST-2 TDS

File Size 449.8 KB

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Safety Data Sheet

Document Name EPO-TEK® P1011-ST-2 SDS

File Size 357.4 KB

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Brand:

Epoxy Technology

Market:

Electronics

Function:

Bonding

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