EPO-TEK® P1011ST-2 - Silver Die Attach Polyimide

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. 

Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.

ASI 502 100% RTV Silicone is a one-component, moisture cure, acetoxy silicone that cures to form an extremely durable rubber that can withstand a variety of extreme environments.Unlike many organic sealants, ASI 502 is extremely resistant to degradation,...

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...