EPO-TEK® P1011ST-2 - Silver Die Attach Polyimide

Seal&Shine Finish is the final step in the SlabArmor™ system, intended to be applied after the placement and finishing process. This high-performance, high-gloss finish, seals, protects and extends the life of your SlabArmor™ floor, eliminating the need for...

Thermally conductive and electrical insulating epoxy with a smooth, flowable consistency, designed for chip bonding. Modified version of EPO TEK® H70E, designed primarily for die stamping 

MIRACLE BOND® REPAIR EPOXY is a multi-purpose, rapid cure, bonding, and repair adhesive. Its specially formulated, non-sag property is ideal for bonding most materials and perfect for both overhead and vertical repairs, while still being easily dispensed from...

ASI 6900 Extreme Fast-Grab Hybrid Adhesive grabs and holds substrates within just a few seconds, making it ideal for holding heavy objects in place while adhesive cures to form a long-term, durable bond. This reduces or eliminates the...

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

Low viscosity epoxy with excellent impact and vibration resistance and improved chemical resistance. May be paired with 3 different catalysts.