EPO-TEK® T6067 - Thermally Conductive Epoxy

Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk.

ASI Compound 70 Multi-Purpose Silicone Grease is a moisture resistant, non-curing paste which retains its consistency and properties over a temperature range of -70°F to 400°F.This stiff, tacky compound is non-melting and retains its properties over extended periods...

THE CRACKER® is a non-explosive cracking agent enabling standard demolition to be carried out with comparative accuracy. This system is virtually noiseless, vibration free and is ecologically friendly.Break Concrete With Concrete Demolition Powder-The Cracker

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. 

Shadow Curable UV Epoxy. Thixotropic version of EPO-TEK® OG198-54.

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.