Features
- Low temperature cure between 80°C and 150°C allows use on lower cost plastics and temperature sensitive devices
- Can be suggested as a lower stress, more resilient alternative of EPO-TEK® 930-4.
- Thixotropic paste allows for application by automatic dispensers or screen printers. It can also be applied by hand or spatula.
- Excellent adhesion to Aluminum, ferrous and non ferrous metals, and most plastics including Kapton.
Applications
- Semiconductor: Thermally conductive underfill / Electrically non conductive die attach, low stress for large die exceeding 500 mil x 500 mil.
- Hybrid Micro-electronics: Large die attach, adhesion to GaAs devices, ceramic substrate attach to housing.
- Fiber Optic Packaging: Substrate attach of optical bench; TECooler attach; good adhesion to Au, Kovar and ceramic; can be used for laser diode and photo-diode attach.
- Liquid Crystal Displays: die-attach micro-LCDs onto flex circuits like Kapton, or rigid carriers like FR4, ceramic, or silicon.
Available Packaging
Please call the technical team at
1-978-667-3805 to discuss packaging options.

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Speak to us on 1-978-667-3805
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EPO-TEK® T7109
Thermal Heatsink AdhesiveLet's talk
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