EPO-TEK® T7109 Thermal Adhesive Heatsink

Features

Low temperature cure between 80°C and 150°C allows use on lower cost plastics and temperature sensitive devices
Can be suggested as a lower stress, more resilient alternative of EPO-TEK® 930-4.
Thixotropic paste allows for application by automatic dispensers or screen printers. It can also be applied by hand or spatula.
Excellent adhesion to Aluminum, ferrous and non ferrous metals, and most plastics including Kapton.

Applications

Semiconductor: Thermally conductive underfill / Electrically non conductive die attach, low stress for large die exceeding 500 mil x 500 mil.
Hybrid Micro-electronics: Large die attach, adhesion to GaAs devices, ceramic substrate attach to housing.
Fiber Optic Packaging: Substrate attach of optical bench; TECooler attach; good adhesion to Au, Kovar and ceramic; can be used for laser diode and photo-diode attach.
Liquid Crystal Displays: die-attach micro-LCDs onto flex circuits like Kapton, or rigid carriers like FR4, ceramic, or silicon.

Downloads

Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK®T7109 TDS

File Size 600.5 KB

View

Safety Data Sheet

Document Name EPO-TEK® T7109 SDS

File Size 305.7 KB

View

Safety Data Sheet

Document Name EPO-TEK® T7109 Syringe SDS

File Size 227.4 KB

View

Brand:

Epoxy Technology

Technology:

Epoxy

Application:

Datacom and Telecom Microelectronics/Semiconductors

Market:

Aerospace and Defense Electronics Optical, Datacom and Telecom

Function:

Bonding Thermal Transfer

Available Packaging

Please call the technical team at
1-978-667-3805 to discuss packaging options.

Related Products

Viewing options:

DP 1010

Water Based Duct Sealant

A premium grade, UL Listed, Low VOC, smooth, water based, high pressure/high velocity duct sealant for commercial and residential supply and return air duct use. The consistency of DP 1010 allows for better coverage and ease of application....

SDS TDS

EPO-TEK® 730

Thixotropic Epoxy Adhesive

All purpose thixotropic and room temperature-curing epoxy adhesive.

TDS

DP 99

Spray Degalvanizer

DP 99 is a degalvanizing spray for use on roll-forming machines, shears, punch press dies and notchers. DP 99 will soften and loosen galvanizing debris while lubricating. Daily use will keep machinery clear of galvanizing build-up. DP 99...

TDS

EPX50LT-OVERLAY

Epoxy Urethane Polymer Resin

EPX50LT-OVERLAY is a moisture-insensitive, low-modulus, epoxy urethane co-polymer overlay resin, designed to be applied in late season cold conditions down to 30 °F and rapid return to service applications.

SDS TDS

ASI 505

Industrial Grade Silicone Self Leveling

ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...

SDS TDS