EPO-TEK® T7109-18 - Flexible Electrically Insulating Epoxy Paste

Available in 2" and 3" sizes

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration. 

HFP 1:1 is a moisture-insensitive, low-modulus, two component, high friction surface polymer designed for binding high friction surfacing aggregates to asphalt, concrete on grade and elevated surfaces.

SlabArmor™ Closer is the second step in the SlabArmor system. This colloidal silica densifier/hardener is applied after power troweling has been completed. A single application is applied to the surface and requires no scrubbing or rinsing. Its reactive...

CRACKBOND® V200 HI-MOD is a two-component, moisture insensitive, high modulus, high strength epoxy healer/sealer deck penetrant, designed to prolong the life of concrete by sealing cracks against moisture and preventing chloride ion intrusion. The super-low viscosity (200 cP),...