EPO-TEK® T7110-38 - Thermally Conductive, Room-Temperature Cure Epoxy

A water based protective coating formulated with an EPA Registered preservative that prevents the growth of mold, mildew, and fungus on the surface of the coating. It is recommended as an encapsulant on worn or damaged fiberglass to...

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

A low viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. The lower viscosity of DP 3060 makes it an ideal lap adhesive for pipe insulation...

CRACKBOND® EPOTHANE T3 is a low-modulus, epoxy urethane skid-resistant overlay. It may be successfully applied and cured at temperatures between 60 °F and 95 °F (16 °C and 35 °C).