EPO-TEK® T905BN-3 - Thermally Conductive Epoxy

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

EPX50‑SC (Standard Cure) is a moisture‑insensitive, low‑modulus epoxy urethane co‑polymer engineered to deliver dependable performance in demanding concrete preservation environments. Applied as a 1/4" to 3/8" single‑ or dual‑layer system, it forms a durable, chemical‑resistant, and waterproof protective...

Low halogen version of OG142-112, single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging applications.

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.

Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

Two component, moisture insensitive, high modulus, epoxy paste available in cartridges and bulk kits. Ideal as a bonding agent, filler, capping material for crack injection or as a pick-proof sealant.