EPO-TEK® T905BN-3 - Thermally Conductive Epoxy

Rapid curing, polyurea control joint filler designed for heavy duty traffic and freezer applications. Low viscosity, self leveling and allows for 10-15% movement of installed joint width. Available in cartridges and bulk. 

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.

General purpose, semi flexible thixotropic adhesives for high CTEsubstrates available in either a light or heavy paste.

A premium quality, low viscosity, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5060 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...

ASI 504 Multi-Purpose Silicone can be used as both a sealant and adhesive for a variety of applications requiring a waterproof seal. It Is a paste-like, one component acetoxy silicone that cures to form a durable solid rubber...

Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration.