EPO-TEK® TD1001-67 - Thermally Conductive Epoxy

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

A residential use UL Listed, Low VOC, fiber reinforced, water based, high pressure/high velocity duct sealant for residential supply and return air duct use. The consistency of DP 1050 allows for easier sealing of holes and gaps often...

Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.

For anchoring threaded rod and rebar, railings, sign posts and parking meters, or patching holes and cracks in roads and sidewalks, ULTRABOND® HARD-ROK contains no metals to cause rust or stains and is suitable for interior or exterior...

NSF/ANSI 61 & 372 CertifiedULTRABOND® HS-1CC is the world’s first anchoring epoxy formulated to be IBC/IRC compliant in both bulk and cartridge delivery systems. For use in dry, damp, water-filled and submerged applications, even in the most extreme...

ISO 10993 Tested/Fully Compliant, Clear and colorless, Low viscosity, room temperature curing epoxy.