EPO-TEK® TD1001-67 - Thermally Conductive Epoxy

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:1 mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).

ASI 174 Siliconized Acrylic Latex is a high performance, paintable sealant used for sealing interior and exterior joints.  ASI 174 Siliconized Acrylic Latex cures to form a strong, flexible water tight seal. ASI 174 is further modified with...

Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.