EPO-TEK® TJ2193-LH2 - Nonconductive Adhesive

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

ASI 388 Electronic Grade RTV Silicone is a one part, moisture cure sealant that cures to form a tough, durable, flexible rubber that is deal for bonding, sealing, encapsulating and protecting electronic parts.Once cured, ASI 388 will withstand...

ASI 505 Self-Leveling RTV Silicone is a one-component, moisture cure, flowable material designed for a variety of potting, coating, sealing and waterproofing applications.Once applied, ASI 505 will begin skinning in 8 minutes and continue curing to form a...

Low stress and low temperature cure temperature version of H35-175MP.

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

EP-SLV is a 100% solids, high-modulus, moisture-insensitive, very low-viscosity epoxy adhesive for gravity feed or pressure injection of cracks in concrete. EP-SLV is a structural repair adhesive designed primarily for pressure injection and gravity feed crack repair in...