EPO-TEK® TR2139-LH - Low Halogen Thermally Conductive Epoxy

Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

Low outgassing silver epoxy meeting MIL-STD 883 /5011 and NASA ASTM E595.

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...

Single component, thermally conductive epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum packaging.

EP75-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.

Pentra-Sil® (HL) is a high-solids blended hybrid lithium densifier designed for concrete densifying and hardening in newly placed or existing slabs. Its reactive formulation fills the micro-pores of the concrete, strengthening the surface and prolonging its life. Pentra-Sil®...