EPO-TEK® TV2001 - Thermally Conductive Epoxy

Black-colored and optically opaque epoxy designed for optical and optoelectronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade epoxy. 

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. 

This elastomeric, Polyurea joint filler (formerly known as JF-311) allows 10-15% movement of installed joint width and can be used in temperatures between -40 °F to 120 °F (-40 °C to 49 °C). Available in cartridges and in...

Optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23ºC to 80ºC, suggested for opto-device flip chip packaging. It can also be used...

ASI 12SK Butyl Sealant is a one part, butyl-based sealant formulated to perform better than the average butyl by using synthetic fibers for more flexibility, better adhesion and greater versatility.ASI 12SK provides a long-term seal between all types...

An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications.