EPO-TEK® H61 - Thermally Conductive Epoxy

A high-strength epoxy grout used primarily when extreme early compressive strength is required. With past experience using this grout and results greater than 20,000 PSI in 24 hours, it is a game changer for the extra large compressor...

A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronics.

A premium quality, solvent based, high performance, fast drying, polystyrene insulation adhesive. DP 2585 is water resistant and temperature resistant to 180° F. It is ideal for bonding polystyrene, polyisocyanurate and phenolic foam insulation sheets and block without...

COLORFAST™ Stain is a chemically reactive, Nano-Lithium® enhanced product that creates beautiful, durable colored concrete. High-solids treatment utilizes lithium densifier to harden and protect both interior and exterior slabs. COLORFAST™ Stain is an ideal solution for all construction...

SlabArmor™ Closer is the second step in the SlabArmor system. This colloidal silica densifier/hardener is applied after power troweling has been completed. A single application is applied to the surface and requires no scrubbing or rinsing. Its reactive...