Overview
These thermally conductive adhesives and encapsulants provide efficient heat dissipation for electronics and high-performance assemblies.
Available in epoxy, urethane, and silicone chemistries, these materials support bonding, potting, and encapsulating applications. Formulations range from 1,000 cps to paste viscosities, with pot lives from 15 minutes to 5 hours. Operating temperatures span -70°C to +235°C, with thermal conductivity up to 4.5 W/m·K. Many products meet UL 94 V-0, NASA ASTM E595, and CTI >600V standards, and are offered in convenient Triggerbond® cartridges.
Thermally conductive adhesives
50-3112
Thermally Conductive
Fast curing epoxy adhesive with high lap shear strength available in the convenient TriggerBond® packaging.
50-3141
Thermally Conductive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
70-3812NC
Thermally Conductive
Aluminum filled epoxy with excellent thermal conductivity that passes ASTM E595 NASA low outgassing.
Thermally conductive encapsulants/potting
50-2369FR
Thermally Conductive
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
50-3150RFRBK
Thermally Conductive
UL 94 V-0 listed potting epoxy with excellent electrical insulation properties with 5 different catalyst options. CAT.12, CAT.30, and CAT.190 provide a wide range of mix viscosity options. CAT.150 and CAT.154 available for a low mix viscosity with...
50-3152FR
Thermally Conductive
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
50-3170
Thermally Conductive
Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.
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