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DP 3030

Water Based Vapor Retarder

A water-based, premium quality, low odor, quick drying, water resistant, vapor retarder mastic for commercial and residential use. DP 3030 is bright white and is formulated to have excellent brush and trowel application properties. DP 3030 is recommended...

DP 3050

Water Based Lagging Adhesive

A medium viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 can be used for bonding and coating jackets of canvas, glass cloth and...

DP 3060

Low Viscosity Lagging Adhesive

A low viscosity, premium quality, UL Classified, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. The lower viscosity of DP 3060 makes it an ideal lap adhesive for pipe insulation...

DP 5050

Water Based Weather Barrier Coating

A medium viscosity, premium quality, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5050 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...

DP 5060

Low Viscosity Weather Barrier Coating

A premium quality, low viscosity, Low VOC, water based, high strength, quick drying, low odor weather barrier coating. DP 5060 is recommended for indoor and outdoor use where a breather mastic is required. It is used for bonding...

EP100-SEAL LM

Low Viscosity Epoxy Sealer

EP100-SEAL LM is a highly penetrating, two-component epoxy healer/sealer.

EPO-TEK® 301

Low Viscosity Optical Grade Epoxy

Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.

EPO-TEK® 301-2

Optically Transparent Epoxy Resin

Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics. 

EPO-TEK® 301-2FL

Low Stress Optical Epoxy

This two-component solution is commonly used for potting, casting, and encapsulation, and is suitable for semiconductor applications like underfill for flip chips and glob top encapsulation. This adhesive is impact and vibration resistant, making it perfect for bonding...