EPO-TEK® E4110-LV
Electrically Conductive Adhesive
EPO-TEK® E4110LV is an electrically conductive, silver-filled flowing epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
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EPO-TEK® E4110-PFC
Electrically Conductive Adhesive
Two component, silver filled, electrically conductive adhesive designed for semiconductor IC packaging and general electronic assembly. It is a thixotropic version of EPO-TEK® E4110, suggested for applications requiring a screen printing process as well as jetting.
EPO-TEK® EE178-9
Electrically Conductive Adhesive
A two component, electrically conductive epoxy adhesive designed for semiconductor, hybrid, PCB and optoelectronic assemblies. It was designed for precision dispensing or stamping of small dot arrays, in ultra fine pitch applications such as connectors to flex-PCB, SMD...
EPO-TEK® EJ2108
Flexible, Silver-filled Adhesive
This is a two component flexible, silver-filled, electrically and thermally conductive low temperature curing adhesive.
EPO-TEK® EJ2189
Electrically Conductive Epoxy
This is an silver-filled epoxy paste designed for low temperature curing from ambient to 80°C, although other heat cures can be used.
EPO-TEK® EJ2189-LV
Electrically Conductive Epoxy
This is an electrically conductive silver-filled epoxy paste designed for low temperature curing from ambient to 80°C.
EPO-TEK® EJ2312
Room Temperature Curing ECA
Two component room temperature curing electrically conductive adhesive.
EPO-TEK® EK1000
Electrically Conductive Silver Filled Adhesive
High thermal conductive silver filled adhesive.
EPO-TEK® EK1000-1
Silver Conductive Epoxy
This is a single component, longer dry time version of EPO-TEK® EK1000 designed for applications requiring longer working time. Offers exeptional thermal management.