EPO-TEK EE178-9 Fast Curing Conductive Epoxy

EPO-TEK® EE178-9 Electrically Conductive Adhesive

A two component, electrically conductive epoxy adhesive designed for semiconductor, hybrid, PCB and optoelectronic assemblies. It was designed for precision dispensing or stamping of small dot arrays, in ultra fine pitch applications such as connectors to flex-PCB, SMD or flip chip bonding. It is a fast curing, thixotropic paste with low bleed out.

SDS TDS

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Type

Document Name

File Size

Technical Data Sheet

Document Name EPO-TEK® EE178-9 TDS

File Size 532.1 KB

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Safety Data Sheet

Document Name EPO-TEK® EE178-9 SDS

File Size 298.2 KB

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Certifications

Brand:

Epoxy Technology

Technology:

Epoxy

Market:

Electronics Optical, Datacom and Telecom

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