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DP SEAM SEALANT
Non Curing Seam Sealant
A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.

ACCU-GROUT HD
High Strength Epoxy Grout
ACCU-GROUT products are three-component, pre-proportioned, industrial grade epoxy grouting systems. ACCU-GROUT is a general construction epoxy grout which is also available in high-strength (ACCU-GROUT HD) and low exotherm (ACCU-GROUT LE) formulations.

EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.

EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.

DP 2585
Polystyrene Foam Spray Adhesive
A premium quality, solvent based, high performance, fast drying, polystyrene insulation adhesive. DP 2585 is water resistant and temperature resistant to 180° F. It is ideal for bonding polystyrene, polyisocyanurate and phenolic foam insulation sheets and block without...
DP SEAM SEALANT
Non Curing Seam Sealant
A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.
ACCU-GROUT HD
High Strength Epoxy Grout
ACCU-GROUT products are three-component, pre-proportioned, industrial grade epoxy grouting systems. ACCU-GROUT is a general construction epoxy grout which is also available in high-strength (ACCU-GROUT HD) and low exotherm (ACCU-GROUT LE) formulations.
EPO-TEK® H21D
High Tg Silver Epoxy
High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications.
EPO-TEK® 730-110
Thermally and Electrically Insulating Epoxy
Room temperature-curing, thermally and electrically insulating epoxy.
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
DP 2585
Polystyrene Foam Spray Adhesive
A premium quality, solvent based, high performance, fast drying, polystyrene insulation adhesive. DP 2585 is water resistant and temperature resistant to 180° F. It is ideal for bonding polystyrene, polyisocyanurate and phenolic foam insulation sheets and block without...


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