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722
Water-Based Pad Adhesive
722 is designed to quickly lock carpet pad into place. This easy-to-use synthetic latex and hydrocarbon resin blend is non-flammable, solvent-free, fast-grabbing, and prevents slippage during power-stretching with its immediate wet-suction.

ULTRABOND® ASF-1000
Fast Curing Cold Weather Doweling Adhesive
Fast curing, styrene free, acrylic system. Numerous DOT approvals. Available in 10 oz. and 28 oz. cartridges. Browse our selection of anchoring and doweling adhesives for vertical construction and transportation infrastructure. Learn more about cold weather epoxy and...

EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.

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Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration.

EPO-TEK® H70E
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722
Water-Based Pad Adhesive
722 is designed to quickly lock carpet pad into place. This easy-to-use synthetic latex and hydrocarbon resin blend is non-flammable, solvent-free, fast-grabbing, and prevents slippage during power-stretching with its immediate wet-suction.
ULTRABOND® ASF-1000
Fast Curing Cold Weather Doweling Adhesive
Fast curing, styrene free, acrylic system. Numerous DOT approvals. Available in 10 oz. and 28 oz. cartridges. Browse our selection of anchoring and doweling adhesives for vertical construction and transportation infrastructure. Learn more about cold weather epoxy and...
SEALANT CHIP BRUSHES
Available in 2" and 3" sizes
EPO-TEK® OG198-54
UV Curable Epoxy
Single component, low viscosity, electrically and thermally insulating shadow curable UV epoxy.
20-1625
Potting & Encapsulating
Optically clear, low viscosity, 1:1 silicone potting system. Ideal for protection from shock and vibration.
EPO-TEK® H70E
Thermally Conductive Adhesive
Two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.


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