Certifications
Related Products

ULTRABOND® 2
Ultrabond Epoxy
With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...

EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.

EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.

ASI 57
Hybrid Polymer Sealant and Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...

EPO-TEK® HYB-353ND-TX2
UV Hybrid Epoxy
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.
ULTRABOND® 2
Ultrabond Epoxy
With slower curing for the warmest southern climates, ULTRABOND® 2 provides a long working time of 28 minutes @ 75°F (24°C) and in-service temperatures to 180°F. For anchoring threaded rod into concrete, ULTRABOND® 2 has a 1:1 mix...
EPO-TEK® 730
Thixotropic Epoxy Adhesive
All purpose thixotropic and room temperature-curing epoxy adhesive.
EPO-TEK® OE121 Black
Underfill Epoxy Adhesive
Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...
EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
ASI 57
Hybrid Polymer Sealant and Adhesive
ASI 57 Hybrid Class 50 Hybrid Sealant and Adhesive is a one-part, low odor, no-sag polyether sealant that uses ASI’s innovative hybrid technology to produce a material that is ideal for a wide range of applications where a...


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