Features
- UL 94 V-0 Listed
- Low mix viscosity
- Low shrinkage
- Low exotherm
- Moisture Resistant
Applications
- Potting of sensitive electronic components part of a UL 94 rated system
Related Products

60-7107RTR
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Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.

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Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.

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60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
50-3141
Flame Retardant Epoxy Adhesive
Fast curing, flame retardant epoxy adhesive that meets UL 94 V-0 requirements. 2:! mix ratio available in dual barrel TriggerBond cartridges and in bulk packaging.
EPO-TEK® HYB-353ND
UV Hybrid
A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking.
10-3005 Series
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).
10-3216
Impact Resistant Adhesive
Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.
EPO-TEK® 377H
Graphite Filled Bonding Epoxy
Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.


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