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EPO-TEK® H65-175MP
Thermally Conductive Epoxy
EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vauum packaging.
EP75-SEAL
Penetrating Healer and Urethane Sealer
EP75-SEAL is a highly penetrating, two-component epoxy healer/sealer. Its rapid cure time allows traffic to re-open in less than six hours.
EPO-TEK® OG142-87
Fiber Optic Epoxy Adhesive
Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application.
EP15-GROUT XP
Exposy Grout with Extended Pot Life
EP15-GROUT XP is a low exotherm formulation of our EP15-GROUT product, providing an extended pot life that makes it more user friendly for warm weather applications and deep pour projects that require more working time. This high-performance epoxy...
CRACKBOND® EPOTHANE T3
Urethane Epoxy Coating
CRACKBOND® EPOTHANE T3 is a low-modulus, epoxy urethane skid-resistant overlay. It may be successfully applied and cured at temperatures between 60 °F and 95 °F (16 °C and 35 °C).
20-3302
Ultra Clear Epoxy Resin for Adhesives & Sealants
Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.
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