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DP SEAM SEALANT
Non Curing Seam Sealant
A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.

EPO-TEK® MED-H20E
Medical Grade Conductive Epoxy
ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use.

20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

EPO-TEK® MED-HYB-353ND
Medical Grade UV Hybrid Epoxy
An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications.

Hot Melt Adhesives
Evans Adhesive's hot melt adhesives provide fast-setting, durable bonds for packaging and converting industries, offering reliable performance, efficient application, and strong adhesion to meet the demands of high-volume production environments.

EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
DP SEAM SEALANT
Non Curing Seam Sealant
A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.
EPO-TEK® MED-H20E
Medical Grade Conductive Epoxy
ISO 10993 biocompatible electrically conductive (ECA) silver-filled epoxy with electrical and high thermal conductivity. It is a well characterized and relied upon ECA, with over 40 years of successful design use.
20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
EPO-TEK® MED-HYB-353ND
Medical Grade UV Hybrid Epoxy
An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications.
Hot Melt Adhesives
Evans Adhesive's hot melt adhesives provide fast-setting, durable bonds for packaging and converting industries, offering reliable performance, efficient application, and strong adhesion to meet the demands of high-volume production environments.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.


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