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EPO-TEK® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
10-2080
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.

60-7185RCL
UV Curable Urethane Acrylate
Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.

10-3005 Series
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).

EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

DP SEAM SEALANT
Non Curing Seam Sealant
A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.
EPO-TEK® HYB-353ND-HV
UV Hybrid Curing Epoxy
A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...
10-2080
Polyurethane Adhesive
10-2080 is a general purpose, semi rigid polyurethane adhesive for bonding a wide variety of plastic and metal substrates. Its flexibility allows bonding to substrates with high coefficients of thermal expansion.
60-7185RCL
UV Curable Urethane Acrylate
Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.
10-3005 Series
High Strength Bonding Epoxy
5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).
EPO-TEK® T7109
Thermal Heatsink Adhesive
Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.
DP SEAM SEALANT
Non Curing Seam Sealant
A non-curing, non-skinning, solvent based pumpable butyl injection seam sealant ideal for sealing seams in Pittsburgh, Button Punch, Snap Lock and roll formed seams. DP Seam Sealant is ideal for coil line applications.Non-curing and non-skinning.Permanently pliable.


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