50-3152FR

50-3152FR Thermally Conductive Potting Epoxy

Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts.

UL File Number E235584.

TDS

Features

Downloads

Type

Document Name

File Size

Safety Data Sheet

Document Name 50-3152RFRBK SDS

File Size 377.0 KB

View

Safety Data Sheet

Document Name 50-3152CFRTA SDS

File Size 281.2 KB

View

Technical Data Sheet

Document Name 50-3152FR TDS

File Size 253.4 KB

View

Brand:

Epoxies, Etc.

Technology:

Epoxy

Application:

Consumer Electronics and PCBA E-mobility

Market:

Automotive and Transportation Electronics Optical, Datacom and Telecom

Related Products

Viewing options:

50-3170

Thermally Conductive Epoxy Rubber Repair Adhesive

Repairable epoxy rubber for low stress encapsulation. Also available as the premixed and frozen F50-3170BK.

TDS

EPO-TEK® 353NDP

PROPEL FORWARD WITH EPO-TEK® 353NDP

Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

SDS TDS

EPO-TEK® HYB-353ND-TX2

UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications.

SDS TDS

20-3305

Thermal Shock Resistance Epoxy

Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.

TDS

EPO-TEK® 377H

Graphite Filled Bonding Epoxy

Graphite-filled, High Temperature Epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer, military, and optical/OEM /fiber optics. It is an electrically conductive version of EPO-TEK® 377.

TDS

60-7107RTR

Electronic Epoxy Adhesive

Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.

SDS TDS