Features
- Long working time
- Low CTE
- Room temperature cure
Applications
- Heat sink bonding
- High thermal conductivity bonding
Related Products

EPO-TEK® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.

50-2369FR
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Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.

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100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

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Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.
EPO-TEK® T7110
Thermally Conductive Electrically Insulating Epoxy
Thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer or optics.
50-2369FR
Flame Retardant Potting Urethane
Flame retardant, UL 94 V-0 listed fungus resistant potting urethane. UL File Number E235584.
20-2362FR
Fire Retardant Urethane
Flame retardant, UL 94 V-0 listed urethane. Low viscosity and low Tg makes this product ideal for cushioning and protecting sensitive electronics. UL File Number E235584.
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
50-3152FR
Thermally Conductive Potting Epoxy
Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.
20-3305
Thermal Shock Resistance Epoxy
Low viscosity thermal shock epoxy with a Dielectric Strength of 1857 V/mil.


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