EPO-TEK® 353ND
Low Outgassing Optical Epoxy
High Temperature Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.
EPO-TEK® 353NDP
Hi-Rel Optical Epoxy
Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...
EPO-TEK® H20E
Silver Filled Electrically Conductive Epoxy
100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.
EPO-TEK® 301
Low Viscosity Optical Grade Epoxy
Room temperature curing epoxy featuring very low viscosity, clear and excellence optical-mechanical properties.
EPO-TEK® 301-1
Spectrally Transparent Epoxy
This is a two-component, room temperature curing epoxy featuring very low viscosity and excellent optical and mechanical properties. It is a lower viscosity version of EPO-TEK® 301.
EPO-TEK® 301-104
Spectrally Transparent Epoxy
EPO-TEK® 301-104 is a single component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.
EPO-TEK® 301-2
Optically Transparent Epoxy Resin
Optically transparent and semiconductor grade epoxy resin with low viscosity, long pot life and good handling characteristics.
EPO-TEK® 301-2FL
Low Stress Optical Epoxy
This two-component solution is commonly used for potting, casting, and encapsulation, and is suitable for semiconductor applications like underfill for flip chips and glob top encapsulation. This adhesive is impact and vibration resistant, making it perfect for bonding...
EPO-TEK® 301-2FL-CX
Low Viscosity Optical Epoxy
This a two component optical epoxy low index version of EPO-TEK® 301-2FL. It features very low viscosity and excellent optical-mechanical properties.
