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EPO-TEK® 353ND

EPO-TEK® 353ND

Low Outgassing Optical Epoxy

High Temperature  Resistance & Low outgassing Epoxy Meeting NASA ASTM E595 & Telcordia GR-1221.

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EPO-TEK® 353NDP

EPO-TEK® 353NDP

Hi-Rel Optical Epoxy

Meet the next generation of high-performance solutions. EPO-TEK® 353NDP takes reliability, durability, and efficiency to unprecedented levels—crafted for the challenges of the AI and Machine Learning era, and critical industries like Datacom & Telecom, Defense, Aerospace, and Automotive. ...

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EPO-TEK® H20E

EPO-TEK® H20E

Silver Filled Electrically Conductive Epoxy

100% solids silver-filled epoxy system for chip bonding in microelectronic and optoelectronic.

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10-3001

High Strength Epoxy Adhesive

 10-3001 is a high bond strength epoxy adhesive that yields high peel strength, excellent tensile strength, along with outstanding thermal shock, impact and vibration resistance. This high-performance epoxide adhesive also exhibits outstanding physical, thermal, and electrical insulation properties. 

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10-3005 Series

10-3005 Series

High Strength Bonding Epoxy

5-minute set, high bond strength epoxy ideal for on field repairs. Also available in high viscosity (HV) and non-sag (NS) versions. Related products include the 10-3020 series (20 minute set) and the 10-3046 series (46 minute set).

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10-3216

10-3216

Impact Resistant Adhesive

Toughened, flexible, and impact resistant adhesive with high peel and shear strength. Ideal for bonding metals, plastics, and rubbers. Also available in a translucent unfilled version, 10-3216TR.

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20-2160

Polyurethane Potting & Encapsulating Resin

This polyurethane system is engineered for electronic potting, encapsulating, and casting applications. It is low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system. 

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20-3302

20-3302

Ultra Clear Epoxy Resin for Adhesives & Sealants

Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.

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50-3152FR

50-3152FR

Thermally Conductive Potting Epoxy

Potting and encapsulating UL 94 V-0 listed epoxy with a CTI > 600 Volts. UL File Number E235584.

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