60-7107RTR
Electronic Epoxy Adhesive
Electronic grade epoxy UV adhesive, coating, and encapsulant with a CTE of 35 ppm/C.
60-7111RCL
UV Curable Urethane Adhesive & Encapsulant
Non-yellowing UV urethane adhesive and encapsulant.
60-7155RCL
UV Curable Potting Epoxy Resin
Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.
60-7185RCL
UV Curable Urethane Acrylate
Low viscosity, clear UV aliphatic urethane acrylate for bonding, coating, or encapsulating.
EPO-TEK® MED-OG198-54
UV & UV Hybrid
EPO-TEK® MED-OG198-54 is a biocompatible, clear, low viscosity, high Tg, high strength, cationic/epoxy UV curing adhesive. It has capillary wicking and is capable of reaching shadowed regions using an oven post cure. It is used in many types...
EPO-TEK® MED-OG198-55
Thixotropic UV Curing Epoxy
ISO 10993 Biocompatible Shadow Cure Capable UV curing epoxy. A translucent cationic/epoxy UV with high viscosity, high Tg, and high strength.
EPO-TEK® OG116
Epoxy-Based Thermal Post Cure
A single-component, high-index, high glass transition temperature (Tg), UV-curable adhesive with high viscosity. Offers good chemical resistance.
EPO-TEK® OG133-7
Flexible UV Cure
This is a single component, UV curable flexible epoxy adhesive/encapsulant designed for semiconductor and opto-electronic packaging.
EPO-TEK® OG133-8
UV Curable Epoxy
A single-component, thixotropic flexible epoxy/encapsulant designed for semiconductor and opto-electronic packaging. Glob top over IC and wire bonds, as well as low-stress bonding of fiber optic components, are typical applications.
