20-3660
High Temperature Epoxy Potting Compound
20-3660 is an electronic grade, 100% solids, epoxy resin system. In addition to its high temperature resistance, 20-3660 also provides outstanding physical properties at elevated temperatures.
30-3711
One Component Epoxy Coating
30-3711 is designed for coating and impregnating applications. It has excellent dielectric strength.
40-3900
Silver Filled Epoxy Resin
40-3900 is a two component epoxy adhesive filled with silver. This electrically conductive epoxy resin formulation offers continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm.
40-3901
Electrically Conductive Epoxy Adhesive
NASA Low Outgassing silver filled epoxy with a volume resistivity of 10^-3.
40-3905
Electrically Conductive Epoxy Adhesive & Coating
40-3905 is an electrically conductive epoxy system designed for applications requiring low temperature cures.
40-3907
Electrically Conductive Epoxy Adhesive
40-3907 is an electrically conductive epoxy system designed for applications requiring low temperature cures
50-1220
One Component Silicone Thermal Grease
This is a heavy filled Heat Sink Compound promotes a high thermal conductivity, low bleed, and high temperature stability.
50-1225
Thermally Conductive Silicone Rubber
50-1225 is a low viscosity, room temperature curing silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
50-1952
Thermally Conductive Silicone Potting & Encapsulating Compound
50-1952 is a two-component silicone potting and encapsulating compound. This silicone system is designed for quick thermal transfer away from heat generating electronic devices.
