EPO-TEK® TV2001
Thermally Conductive Epoxy
A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits.
EPO-TEK® TZ101
Thermally Conductive Adhesive
Single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics.
EPO-TEK® U300-22
Optically Clear Epoxy
This epoxy offers a long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy suitable for electronic applications such as smart cards, RFIDs, and wafer level camera optics.
EPO-TEK® UD1355
Epoxy-Based Thermal Post Cure
Optically clear, low-viscosity UV adhesive and encapsulant with resistance to discoloration during solder reflow.
EPO-TEK® UJ1190
Epoxy-Based Thermal Post Cure
Low-viscosity, clear UV epoxy ideal for thick sections.
EPO-TEK®H20E-SLR-HV
Electrically Conductive, Silver Epoxy
This is a two-component, electrically conductive, epoxy adhesive designed for solar ribbon bonding of photovoltaic modules. It provides the electrical back-contact for ribbon stringing of solar cells into modules and panels. It is a higher viscosity version ofEPO-TEK®...
