EPO-TEK® MED-353ND-T - Biocompatible Nonconductive Adhesive

Thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid microelectronics, and optical industries.

ASI 335 Window & Door Sealant is a single component, nonslump, moisture curing neutral cure oxime silicone that cures to form a tough, non-corrosive, flexible rubber with outstanding resistance to weather & UV degradation.ASI 335 Window & Door...

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

Two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. 

DP Wrap is a polyethylene film with a high-tack adhesive designed to provide protection from moisture, dust, debris, and paint. The film is easily removed, tear resistant and UV resistant.Covering round and rectangular duct during transportation, storage and...

Low Halogen, Low Temperature Cure and High Tg Optical epoxy. Faster Curing than our GOLD STANDARD EPO-TEK® 353ND