EPO-TEK® MED-353ND-T - Biocompatible Nonconductive Adhesive

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

A high viscosity, premium quality, Low VOC, water based, quick drying, low odor lagging adhesive and protective coating for indoor use. DP 3050 HV can be used for bonding and coating jackets of canvas, glass cloth and other...

An ISO 10993 Medical grade, single component, UV hybrid curing epoxy for semiconductor, and fiber optic applications.

Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.

Medium hardness polyurethane with excellent dielectric strength and low toxicity. Also available as faster gelling versions 20-2183 and 20-2184. Softer Shore A Hardness versions available as 20-2101, 20-2140, and 20-2160.

CRACKBOND® 2300 GEL (formerly ULTRABOND® 2300) is a two-component, 100% solids, high-strength epoxy bonding adhesive. It is a solvent free, high modulus, moisture insensitive, non-sag epoxy system. CRACKBOND® 2300 GEL is ideal for use in temperatures from 60°F...