EPO-TEK® MED-353ND-T - Biocompatible Nonconductive Adhesive

EPO-TEK® HYB-353ND-TX2

UV Hybrid Epoxy

A single component, high temperature hybrid epoxy for semiconductor, and fiber optic applications. 

EPO-TEK® OE121 Black

Underfill Epoxy Adhesive

Low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the...

ULTRABOND® HS-1CC

High Strength Anchoring Epoxy

NSF/ANSI 61 & 372 CertifiedULTRABOND® HS-1CC is the world’s first anchoring epoxy formulated to be IBC/IRC compliant in both bulk and cartridge delivery systems. For use in dry, damp, water-filled and submerged applications, even in the most extreme...

EPX50-OVERLAY

Moisture Insensitive Epoxy Polymer Overlay

EPX50-OVERLAY is a moisture-insensitive, low-modulus, 3/8” two layer chemical and waterproof epoxy urethane co-polymer overlay that provides an anti-skid surface for bridge decks, elevated slabs and PCCP. It may also be used for high friction surface treatment applications and as...

Dextrin Adhesives

Evans Adhesive dextrin products provide high-performance bonding for packaging, labeling, and paper converting. Known for their versatility, they offer consistent adhesion and easy application across a range of industrial uses.

60-7155RCL

UV Curable Potting Epoxy Resin

Potting and adhesive UV resin with very low viscosity that passes ASTM E595 low outgassing.