EPO-TEK® MED-354-2 - Biocompatible Optical Adhesive

High glass transition temperature silver epoxy designed for chip bonding in microelectronic and optoelectronic applications. 

ASI 335 Window & Door Sealant is a single component, nonslump, moisture curing neutral cure oxime silicone that cures to form a tough, non-corrosive, flexible rubber with outstanding resistance to weather & UV degradation.ASI 335 Window & Door...

ASI 5900 Fast Grab Hybrid Adhesive uses ASI’s innovative hybrid technology to develop immediate green strength to fixture substrates while the adhesive cures and provides a long-term, durable bond. ASI 5900 is 100% solids.It will not shrink and...

A single component, high temperature epoxy for semiconductor, hybrid, and fiber optic applications. It is designed to have similar cured performance to EPO-TEK® 353ND; modified to allow for initial UV tacking. It is a higher viscosity version of...

Single component, low viscosity, UV curable epoxy for adhesive sealing and encapsulating fiber optic and optoelectronic packaging application. 

Ultra clear epoxy with an RI of 1.523 at 589 nm. High purity grade polymer system with a bubble free and glass smooth finish. Available as lower viscosity version 20-3302NCLV.